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Analytical equipment by industry and model

Printed Wiring Boards (TAB/COF)

Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
Process Model Managed components Catalog no.
Development Na2CO3 pH, sodium carbonate, resist M-01
K2CO3 pH, potassium carbonate M-02
Soft etching Na2S2O8 , H2SO4 , Cu Sodium persulfate, sulfuric acid, copper M-08
H2O2 , H2SO4 , Cu Hydrogen peroxide, sulfuric acid, copper M-07
Etching CuCl2 Hydrochloric acid, cupric chloride M-16
Stripping NaOH Sodium hydroxide M-05
Desmear NaMnO4 , NaOH Sodium permanganate, sodium hydroxide M-19
Catalyst Pd Palladium M-26
DMAB Dimethylamine-borane M-15
Electroless copper plating NaOH , HCHO , Cu Sodium hydroxide, formalin, copper M-21
Electrolytic copper plating (copper sulfate bath) H2SO4 , Cu , Cl Sulfuric acid, copper , Chlorine M-29
Fe3+ Trivalent iron M-17
Black oxide NaClO2 , NaOH Sodium chlorite, sodium hydroxide M-12
K2S2O8 , NaOH Potassium persulfate, sodium hydroxide M-20
Electroless nickel plating Ni , NaH2PO2 pH, nickel , NaH2PO2 M-13
Ni pH, nickel M-22
DMAB Dimethylamine-borane M-15

Plastic Plating Market

Analytical equipment for use with a variety of plastic plating wet processes
Process Model Managed components Catalog no.
Degreasing NaOH Sodium hydroxide M-30
Catalyst Pd Palladium, chromium M-25
Electroless nickel plating Ni , NaH2PO2 pH, nickel , NaH2PO2 M-13
Electrolytic copper plating (copper sulfate bath) H2SO4 , Cu , Cl Sulfuric acid, copper , Chlorine M-29
Electro-nickel plating (Watts bath) Ni , Cl , H3BO3 Nickel sulfate, nickel chloride M-23
Conductive processing Cu Copper M-28

Flat-panel Display Market

Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
Process Model Managed components Catalog no.
Cleaning TMAH Tetramethylammonium hydroxide M-03
NaOH Sodium hydroxide M-30
KOH Potassium hydroxide M-06
Development Na2CO3 pH, sodium carbonate M-01
TMAH Tetramethylammonium hydroxide M-03
NaOH Sodium hydroxide M-30
KOH Potassium hydroxide M-06
MEA Monoethanolamine M-04
TEA Triethanolamine M-18
Etching Ce , HNO3 Ceric nitrate, nitric acid M-11
C2H2O4 Oxalic acid M-09
H3PO4 , HNO3 , C2H4O2 Phosphoric acid, nitric acid, acetic acid M-10
Stripping Na2CO3 pH, sodium carbonate M-01
NaOH Sodium hydroxide M-30
KOH Potassium hydroxide M-06
MEA Monoethanolamine M-04

Plating Processing Market

Analytical equipment for use with electroless, electroplating wet processes
Process Model Managed components Catalog no.
Electrolytic degreasing NaOH Sodium hydroxide M-05
Electroless copper plating NaOH , HCHO , Cu Sodium hydroxide, formalin, copper M-21
Electroless nickel plating Ni , NaH2PO2 pH, nickel , NaH2PO2 M-13
Electro-nickel plating (sulfamic acid bath) Ni , Cl , H3BO3 Nickel sulfamate, nickel chloride, pH, Boric acid M-24
Electro-nickel plating (Watts bath) Ni , Cl , H3BO3 Nickel sulfate, nickel chloride , pH, boric acid M-23
Electro-copper plating (copper sulfate bath) H2SO4 , Cu , Cl Sulfuric acid, copper , Chlorine M-29
Fe3+ Trivalent iron M-17
Zinc plating (zincate bath) Zn, NaOH Zinc, sodium hydroxide M-14
Electro-alloy plating (black Ni-Zn) Zn Zinc M-14
Ni pH, nickel M-22
Electroless-palladium plating Pd Palladium M-31
Electroless-gold plating Au pH, gold M-27
Electro-gold plating Au pH, gold M-27