Research and Development
Announced document
- The Whisker Prevention SnBi Plating
- Thermal cycling test of Sn-Bi and Sn plating
- Effect of Reflow Temperature of Tin-Bismuth Finish to Thermal Cycling Test
- Role of Grain-boundary-free Energy & Surface-free Energy for Tin Whisker Growth
- Growth Mechanism of Tin Whisker
Announcement history such as academic societies
| 1996 | "Tin-Bismuth Plating Technologies and its joint characters"［4th］Packaging technology forum for environment，T.Kudo |
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| 2002 | "Whisker mitigation by the pretreatment of metal finishing" 105th Meeting of The Surface Finishing Society of Japan,E.Uchida、T.Hara |
| 2003 | "Role of Grain-boundary-free Energy & Surface-free Energy for Tin Whisker Growth" IPC-Jedec Conf.-Frankfort，K.Tsuji |
| 2004 | "Current state of the Pb free plating" METEC'04 Technological meeting，E.uchida |
| 2006 | "Current state and problems of the Pb free plating" SURTECH & Coating Japan 2006, E.Uchida |
| 2006 | "Pb free solder plating" Symposium of the Electroplating society 2006,I.Fujimura |
| 2007 | "Plating technology for the tin whiskers"Pb Free Packaging Forum (Ⅳ), I.Fujimura |
| 2008 | "Lead free plating technology for tin whisker mitigation" Application for Technical Conference of the 37th Internepcon Japan，I.Fujimura |
Publishing history like magazine etc
- "Role of Grain-boundary-free Energy & Surface-free Energy for Tin Whisker Growth"
K.Tsuji,AESF SUR/FIN 2003 proceedings,P169（2003） - "Study on the Mechanism of Sn Whisker Growth: Part I"
K. Tsuji, Journal of the Surface Finishing Society of Japan, vol.57;No.6;p451(2006) - "Study on the Mechanism of Sn Whisker Growth: Part II"
K. Tsuji, Journal of the Surface Finishing Society of Japan, vol.57; No.7;p529(2006) - "Growth Mechanism of Tin Whisker"
K. Tsuji, Journal of the Surface Finishing Society of Japan, vol.58;No.7;p406(2007) - "Tin-Bismuth Plating Technology for Tin Whisker Mitigation"
I. Fujimura, Function & Materials, vol.28 No.9 p41(2008),